Method for forming conductor layers and method for fabricating m

Details Method for forming conductor layers and method for fabricating m Method for forming conductor layers and method for fabricating m

1988-12-08

1990-10-16

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437230, H01L 21283

Patent

active

049635123

ABSTRACT:
A method for forming conductor layers of substrates for mounting LSIs and the like and a fabrication method of multilayer substrates are disclosed. These methods comprise steps of forming a metal underlayer having a shape similar to that of a conductor pattern on the substrate, forming an insulation layer over portions of the substrate which are not covered by the metal underlayer, and disposing a plating layer on the metal underlayer by carrying out electroless plating while using the insulation layer as the resist and thereby forming conductors. As compared with a conventional conductor layer forming method, the number of fabrication steps is reduced. And the elimination of the surface grinding step facilitates the fabrication.

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Moriya et al., IEEE Electronic Components Conf. 1984, 0569-5503/84/0000-0082, pp. 82-87.

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