Support for lead frame for IC chip carrier

Details Support for lead frame for IC chip carrier Support for lead frame for IC chip carrier

1984-03-26

1985-11-19

Askin, Laramie E.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

206330, 357 70, H01L 2328, H01L 2350

Patent

active

045544042

ABSTRACT:
A support for a lead frame for use with an integrated circuit chip is made of electrically insulative material, preferably a thermoplastic. There is a pad area at the center of the support in which an IC chip can be disposed. Proximate the periphery of the pad are raised spaced-apart projections. The spaces between the projections define slots in which the leads of a lead frame can be disposed.

REFERENCES:
patent: 3469684 (1969-09-01), Keady et al.
patent: 3838984 (1974-10-01), Crane et al.
patent: 4107555 (1978-08-01), Haas et al.
patent: 4138691 (1979-02-01), Bonkohara et al.
patent: 4218701 (1980-08-01), Shirasaki
patent: 4381602 (1983-05-01), McIver

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