Method for producing hybrid integrated circuit substrate

Details Method for producing hybrid integrated circuit substrate Method for producing hybrid integrated circuit substrate

1989-01-06

1990-10-16

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427102, 427103, 430315, C23C 2600

Patent

active

049633899

ABSTRACT:
A method for producing a high density hybrid integrated circuit substrate capable of forming a very fine pattern of a conductor by means of the chemical plating and at the same time capable of applying the chemical plating, while protecting the resistor formed on the substrate in advance of the chemical plating step, the production method comprising steps of: forming a resistor on an electrically insulating substrate; forming an activating layer for depositing a chemical plating on the electrically insulating substrate in contact with the resistor; forming a stable resin layer, during the chemical plating step, by the photolithography process in a manner to cover the resistor, except for the portion of the activating layer where an electrically conductive layer is to be formed; and forming the electrically conductive layer by the chemical plating on the exposed portion of the activating layer.

REFERENCES:
patent: 4150995 (1979-04-01), Moritsu
patent: 4268614 (1981-05-01), Ueyama
patent: 4394434 (1983-07-01), Rohloff
patent: 4404237 (1983-09-01), Eichelberger
patent: 4424251 (1984-01-01), Sugishita et al.
patent: 4460624 (1984-07-01), Graciet
patent: 4464420 (1984-08-01), Taguchi et al.
patent: 4510179 (1985-04-01), Honjo
patent: 4629681 (1986-12-01), Takada
patent: 4645734 (1987-02-01), Takada
patent: 4685203 (1987-08-01), Takada
patent: 4752555 (1988-06-01), Takada
Base Metal Thick Film Materials, a Review of Their Technology & Applications, Christopher R. S. Needes, E. I. Du Pont de Nemours & Co., Inc., Photo Products Department, Electronic Materials Division, Wilmington, Del. 1989, pp. 94-101.

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