Patent
1987-05-18
1989-07-04
Sikes, William L.
350 9613, 350 9614, G02B 610, G02B 612
Patent
active
048445711
ABSTRACT:
An optical interconnection system for integrated circuits has an optical source that is split into at least two parts. One part is modulated and the other part is transmitted to a detector and input on the local oscillator signal in homodyne detection. A single source may be split many ways to provide a plurality of beams for modulating and a plurality of local oscillator inputs to separate detectors. Both inter and intra wafer connections are described.
REFERENCES:
Electronic Design, vol. 30, No. 11, 5/1982, pp. 44-55, M. Grossman "Optical Devices in Wells Join Electronic Circuitry on Ship".
Patent Abstracts of Japan, vol. 7, No. 84, (E-169) [1229], Apr. 8, 1983; & JP-A-58 12 451 (Nippon Denshin Denwa Kosha) 24-01-1983).
Goodman et al, "Optical Interconnection for VLSI Systems", IEEE, vol. 72, No. 7, Jul., 1984.
M. Kimura et al, Jap., Jl. Appl. Phys., Vol. 19, No. 7, Jul. 1980, pp. L372- L374.
Sikes William L.
Ullah Akm E.
LandOfFree
Homodyne interconnections of integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Homodyne interconnections of integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Homodyne interconnections of integrated circuits will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-848468