Compact circuit package having an improved lead frame connector

Details Compact circuit package having an improved lead frame connector Compact circuit package having an improved lead frame connector

1982-03-01

1984-05-15

Tolin, G. P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361399, 361421, 339258S, H05K 720

Patent

active

044491654

ABSTRACT:
A compact circuit package (11) includes an electrically insulating heat conducting substrate (19) providing a substantially planar surface connected to substantially enclose a circuit containing cavity (16) provided by an electrically insulating housing (12). A lead frame connector (23) includes a fixed section (30) permanently bonded to the substrate surface (20) and a movable tab portion (29) which is separated from the fixed section (30) by a pair of spaced substantially parallel slots (25). The movable tab (29) lies along the substrate surface (20) without being bonded thereto and is bendable along a bend line (28) in response to axially movement of an inter-connected lead frame extension (32). A pair of spaced projections (35, 36) on the lead frame extension (32) engage a stop provided by an inner wall surface (13) of the housing (12) to limit movement of the inter-connected tab (29) and lead frame extension (32) without damaging the permanent bond between the fixed section (30 ) and the substrate (19).

REFERENCES:
patent: Re28295 (1975-01-01), Peetz et al.
patent: 3501598 (1970-03-01), Lis
patent: 3801728 (1974-04-01), Gallo, Jr.
patent: 4218724 (1980-08-01), Kaufman
Power Hybrid Module, Liv, IBM Tech. Discl. Bull., vol. 16, No. 11, Apr. 1974, pp. 3826, 3827.

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