Metallizing paste for circuit board having low thermal expansion

Details Metallizing paste for circuit board having low thermal expansion Metallizing paste for circuit board having low thermal expansion

1988-03-04

1990-10-16

Lechert, Jr., Stephen J.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 113, 106 115, 106 126, 106 128, 252514, 252518, 252520, 252521, 75252, B22F 700

Patent

active

049631870

ABSTRACT:
Metallizing paste is composed, by weight, of 100 parts of Pt, 0.5 to 5 parts of Ag, 0.1 to 1 part of CuO, and 2 to 10 parts of a low thermal expansion fritt, which may also contain up to 100 parts of Au. Another metallizing paste is composed, by weight, of 100 parts of Pd, 0.5 to 4 parts of Ag, 0.1 to 1 part of CuO, and 1 to 10 parts of a low thermal expansion fritt, which may also contain up to 50 parts of Au. A low thermal expansion circuit board with multi-layers is made up to a low thermal expansion substrate such as crystallized glass, A1N, SiC, Si.sub.3 N.sub.4 etc. and metallized layers formed on the surface of the substrate based on the abovementioned metallizing pastes comprising crystallized glass type materials.

REFERENCES:
patent: 4301324 (1981-11-01), Kumar et al.
patent: 4513062 (1985-04-01), Suzuki et al.
patent: 4529835 (1985-07-01), Mizuno
patent: 4559277 (1985-12-01), Ito

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