Photosensitive composition for offset printing comprising a bind

Details Photosensitive composition for offset printing comprising a bind Photosensitive composition for offset printing comprising a bind

1992-02-28

1995-02-28

Baxter, Janet C.

Radiation imagery chemistry: process, composition, or product th

Microcapsule, process, composition, or product

430157, 430165, 430175, 430176, 430190, 430191, 430192, 430193, 430278, 430281, 430283, 430285, 430288, 430302, G03C 172, G03F 7021, G03F 7023, G03F 7027

Patent

active

053936370

ABSTRACT:
Disclosed is a photosensitive composition used for offset printing, which provides an offset printing plate with excellent durability and developability. The photosensitive composition comprises:
(I) a film-forming binder resin,
(II) a photosensitive substance, and
(III) a microgel having a particle size of 0.01 to
2.0 .mu. prepared by emulsion polymerization using a polymeric emulsifier having an Sp value of 9 to 16.

REFERENCES:
patent: 3895082 (1975-07-01), Hochberg
patent: 4273851 (1981-06-01), Muzyczko et al.
patent: 4414278 (1983-11-01), Cohen et al.
patent: 4550073 (1985-10-01), Neiss et al.
patent: 4551415 (1985-11-01), Cohen et al.
patent: 4726877 (1988-02-01), Fryd et al.
patent: 4753865 (1988-06-01), Fryd et al.
patent: 4894315 (1990-01-01), Feinberg et al.
patent: 4937173 (1990-06-01), Kanda et al.
patent: 4956252 (1990-09-01), Fryd et al.
patent: 5077175 (1991-12-01), Fryd et al.
Patent Abstracts of Japan, vol. 12, No. 107 (P-686) (2954) (1988).

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