Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1994-03-28
1995-01-10
Paumen, Gary F.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 2368
Patent
active
053802101
ABSTRACT:
A connector for electrically connecting circuit members having a high density of contact pads located in an area array, the connector having an area array specific holder that is simple to produce for retainably positioning mass-produced standardized contact modules containing a deformable contact within a module body for interconnecting the contact pads, where the contact is constructed to be supportingly engaged by the module body to provide sufficient opposing spring force to effect a wiping interconnection between the contact and the contact pads.
REFERENCES:
patent: 4090293 (1978-05-01), van der Donk et al.
patent: 4161346 (1979-07-01), Cherian et al.
patent: 4505529 (1985-03-01), Barkus
patent: 4511197 (1985-04-01), Grabbe et al.
patent: 4513353 (1985-04-01), Bakermans et al.
patent: 4699593 (1987-10-01), Grabbe et al.
patent: 4752231 (1988-06-01), Olsson
patent: 4961709 (1990-10-01), Noschese
patent: 4969826 (1990-11-01), Grabbe
patent: 5046967 (1991-09-01), Majernik et al.
patent: 5061192 (1991-10-01), Chapin et al.
patent: 5098305 (1992-03-01), Krajewski et al.
patent: 5139427 (1992-08-01), Boyd et al.
patent: 5167512 (1992-12-01), Walkup
Grabbe Dimitry
Korsunsky Iosif
Laub Michael F.
Nina Driscoll A.
Paumen Gary F.
The Whitaker Corporation
Wolstoncroft Bruce J.
LandOfFree
High density area array modular connector does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with High density area array modular connector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High density area array modular connector will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-847431