Plating cell with horizontal product load mechanism

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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Details

204273, 204283, 204297R, 204DIG7, 4274301, 427437, 118429, 118500, C25D 1700

Patent

active

059320770

ABSTRACT:
A wet process apparatus, e.g., plating cell for plating a flat substrate introduces a flow of electrolyte or other plating solution across the surface of the substrate to be plated. The substrate is mounted on a holder that is positioned on a door that swings between a horizontal open position and a vertical closed position. There is a circular opening in a front wall against which the door seats. The door can have a sealing ring that contacts the wall of the cell outside of the opening. A cathode ring disposed in a recess in the periphery of the opening makes electrical contact with the substrate. The cathode ring can include a thin metal thieving ring. A fluid-powered rotary blade or wiper within the plating chamber rotates to draw bubbles or other impurities from the substrate, and a megasonic transducer applies megasonic acoustic energy to the solution, e.g., at 0.2 to 5 Mhz. The cell can be used for electroless or galvanic plating.

REFERENCES:
patent: 3907649 (1975-09-01), Becker
patent: 4081347 (1978-03-01), Becker
patent: 4447306 (1984-05-01), Ushio et al.
patent: 5597460 (1997-01-01), Reynolds
patent: 5683564 (1997-11-01), Reynolds
patent: 5865894 (1999-02-01), Reynolds

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