Flux for soldering using solder preforms

Metal treatment – Compositions – Fluxing

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148 22, 148 24, 148 25, 228207, 228223, B23K 3536

Patent

active

059320303

ABSTRACT:
A flux composition for use together with solder preforms, which comprises rosin, N-unsubstituted or N-substituted 2-pyrrolidone, and optionally a high boiling point ester solvent with a content of N-unsubstituted or N-substituted 2-pyrrolidone being 3-50% by weight and a content of the ester solvent being not greater than 30% by weight.

REFERENCES:
patent: 3139360 (1964-06-01), Voida
patent: 3963529 (1976-06-01), Tsunashima
patent: 4218248 (1980-08-01), Snyder et al.
patent: 4670298 (1987-06-01), Lucas et al.
patent: 5004509 (1991-04-01), Bristol
patent: 5129962 (1992-07-01), Gutierrez et al.
patent: 5376403 (1994-12-01), Capote et al.
patent: 5417771 (1995-05-01), Arita et al.
patent: 5452840 (1995-09-01), Turner
patent: 5558109 (1996-09-01), Cala et al.
Manko, H.H., "Solders and Soldering: Materials, Design, Production, and Analysis for Reliable Bonding", Ch. 10, "Paste and Preforms", McGraw-Hill, Inc. pp. 408-439. (no month given), 1992.
Manko: Solders & Soldering Chapt #10.
Derwent WPI Abstract (English) of WO 8605428 dated Sep. 25, 1986.
Patent Abstracts of Japan, vol. 16, No. 40, Apr. 8, 1992, of JP 04 000393 dated Jan. 6, 1992.
Patent Abstracts of Japan, vol. 16, No. 273, Jun. 18, 1992, of JP 04 068095 dated Mar. 3, 1992.

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