Cleaning and drying photoresist coated wafers

Details Cleaning and drying photoresist coated wafers Cleaning and drying photoresist coated wafers

1998-01-12

1999-08-03

El-Arini, Zeinab

Cleaning and liquid contact with solids

Processes

Including use of vacuum, suction, or inert atmosphere

134 2, 134 254, 134 255, 134 26, 134 37, 134902, 134 30, B08B 304, B08B 500

Patent

active

059320273

ABSTRACT:
A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid having water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas having a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.

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