Epoxy resin compositions curable above 160 F. and below 250 F.

Details Epoxy resin compositions curable above 160 F. and below 250 F. Epoxy resin compositions curable above 160 F. and below 250 F.

1985-12-23

1988-06-07

Nielsen, Earl

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

528 45, 528 94, 528 98, 528 99, 528117, 528361, 528367, 525504, C08G 5940

Patent

active

047497297

ABSTRACT:
New and improved heat curable compositions are disclosed comprising epoxidic prepolymers and mono- and di-imidazole-carboxamides. The compositions are stable at room temperature, but cure readily at moderate temperatures of substantially less than about 250.degree. F., preferably at about 180.degree. F. to about 200.degree. F. and especially preferably at about 160.degree. F. to about 180.degree. F. The cured neat resins are useful as adhesives and as matrix resins in reinforced composites, with excellent physical properties.

REFERENCES:
patent: 4210704 (1980-07-01), Chandross et al.
patent: 4335228 (1982-06-01), Beitchman et al.
patent: 4355058 (1982-10-01), Gras et al.
patent: 4420605 (1983-12-01), Kaufman
Lee et al., Handbook of Epoxy Resins, McGraw-Hill, N.Y., 1967 Ed., pp. 20-1 and 20-13; TP1180.E6 L4.

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