Composition for preparing printed circuit through-holes for meta

Details Composition for preparing printed circuit through-holes for meta Composition for preparing printed circuit through-holes for meta

1990-04-18

1992-07-21

Willis, Jr., Prince

Compositions

Compositions containing a single chemical reactant or plural...

Organic reactant

252 791, 252158, 427307, 427 96, 427 97, 134 26, C09K 1302, B05D 304, B08B 300

Patent

active

051320380

ABSTRACT:
Disclosed herein are compositions for use in a process for preparing the surfaces of through-holes in printed circuit boards (especially multilayer printed circuit boards) preparatory to a treatment of the through-holes with an alkaline permanganate solution, the composition being in the form of a substantially homogeneous, substantially clear mixture comprised of a substantially water-immiscible organic material which acts upon the insulating substrate of the circuit board, water, an alkakli metal compound and a surfactant component. The composition is useful as a pretreatment prior to the use of an alkaline permanganate solution in a desmearing and/or etch-back process, a combined desmearing-conditioning process, or a conditioning process following a separate desmearing process.

REFERENCES:
patent: 4125475 (1978-11-01), Dean et al.
patent: 4125476 (1978-11-01), Dean et al.

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