Power semiconductor module

Details Power semiconductor module Power semiconductor module

1986-10-31

1988-08-23

Edlow, Martin H.

357 74, 357 75, 357 79, H01L 3902

Patent

active

047664819

ABSTRACT:
A power semiconductor module includes a multi-layered substrate formed of a first ceramic bottom plate, at least one second ceramic plate disposed above and parallel to the first ceramic bottom plate, a metal foil in the form of a textured metallization located between and directly bonded to the ceramic plates, the second ceramic plate having cutouts formed therein, and assembly elements soldered in the cutouts.

REFERENCES:
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4338621 (1982-07-01), Braun
patent: 4387388 (1983-01-01), Zakhariyz
patent: 4488167 (1984-12-01), Neidig et al.
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4639759 (1987-01-01), Neidig et al.

Affiliated with

Also associated with

Rating

Power semiconductor module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Power semiconductor module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Power semiconductor module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-838928