Thermal barrier for high temperature molding

Details Thermal barrier for high temperature molding Thermal barrier for high temperature molding

1988-12-23

1991-12-17

Kendell, Lorraine T.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Composite having voids in a component

4283044, 428323, 428325, 428402, 4283139, B32B 514, B32B 516, B32B 1800

Patent

active

050734431

ABSTRACT:
This invention is directed to a thermal barrier layer particularly adapted for insulating a solid flowable particulate polymeric pressure transfer medium from elevated temperatures during high temperature molding. A method useful with the thermal barrier comprises transferring pressure from a pressure means via the thermal insulation layer to an article and exposing the article to temperatures of about 316.degree. C. to about 1371.degree. C. An exemplary thermal barrier comprises at least two flexible layers of beads having a thermal insulation of less than about 2 k.

REFERENCES:
patent: 4104102 (1978-08-01), Eagon et al.
patent: 4713295 (1987-12-01), Laroche
patent: 4880688 (1989-11-01), Kromrey

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