Semiconductor device with composite lead wire

Details Semiconductor device with composite lead wire Semiconductor device with composite lead wire

1982-09-23

1985-06-04

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 81, 357 67, 357 70, 174 52FP, 174 16HS, H01L 2336, H01L 2354, H01L 2314

Patent

active

045218013

ABSTRACT:
A semiconductor device, for example a solar battery cell with a semiconductor element and a composite lead wire attached to the semiconductor element in which the lead wire includes a core and a cover overlying the core. The core has a lower thermal expansion coefficient than that of the semiconductor element, and the cover has a higher thermal expansion coefficient than that of the element and a higher electrical conductivity than that of the core. The lead wire therefore has substantially the same thermal expansion coefficient as that of the semiconductor element.

REFERENCES:
patent: 3248681 (1966-04-01), Reintgen
patent: 3311798 (1967-03-01), Gray
patent: 4025997 (1977-05-01), Gernitis et al.
"Clad Lead Frames Take Out More Heat", Lineback-Electronics-Aug. 11, 1981, pp. 38, 39.

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