Image sensor assembly and packaging method

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks

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257433, H01L 23544

Patent

active

059988789

ABSTRACT:
An image sensor assembly is mounted in an optical system having a plurality of reference locators. The image sensor assembly includes an image sensing device having photolithographically generated elements, such as image sensing sites, and a carrier package for enclosing the image sensing device. The carrier package has externally accessible reference features that are optically aligned with respect to the photolithographically generated elements on the image sensing device. Moreover, the externally accessible reference features are used to exactly constrain the image sensor assembly relative to the reference locators. Referencing the image sensing device to the same features that are used for exact constraint removes the effect of material variations that may cause dimensional changes and eliminates the need to activate the sensor for alignment of the sensor assembly in the optical system.

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"Exact constraint design" by Jon M. Kreigel. Mechanical Engineering, May 1995, pp. 88-90.

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