Surface position detecting method, surface position adjusting ap

Details Surface position detecting method, surface position adjusting ap Surface position detecting method, surface position adjusting ap

1999-03-30

1999-12-07

Allen, Stephone

Radiant energy

Photocells; circuits and apparatus

Photocell controls its own optical systems

356400, 355 53, 2505594, G01N 2186

Patent

active

059988010

ABSTRACT:
A projection area (exposure area) on a wafer W, in which a mask pattern is transferred, is divided into, for example, four quadrants. A slit or X-shaped pattern is projected by a light-transmitting optical system so that a plurality of images are formed at a regular interval in the projection area on the wafer W. Luminous flux reflected from the images on the wafer W is received by a light-receiver and converted into photoelectric signals. A master controller calculates the focal values of the first through fourth quadrants along the optical axis based on the photoelectric signals. An optimum focal position and a leveling amount are determined based on the focal values of the first through fourth quadrants. Even if there are level differences in the wafer surface, the optimum focal position and the leveling amount can be accurately determined.

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