Printed-circuit substrate and method of making thereof

Details Printed-circuit substrate and method of making thereof Printed-circuit substrate and method of making thereof

1990-04-02

1992-01-07

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including aperture

428209, 428457, 428901, 361397, 427 96, 156 60, B32B 900

Patent

active

050790650

ABSTRACT:
The present invention is directed toward a printed-circuit substrate comprisng a first layer having through holes formed through a sheet impregnated with resin which shows a half-hardened property at the time of impregnation, a first electrically conductive circuit provided on the sheet, and a second layer having an electrically conductive circuit provided on either a metal or resin substrate. The first and second layers are pressure-stuck to each other and the through holes are filled with an electrically conductive material. The present invention is also directed to a method of making a printed-circuit substrate comprising the steps of: forming through holes and a first electrically conductive circuit respectively throgh and on at least one layer of a sheet impregnated with resin which shows a half-hardened property at the time of impregnation, thereby forming a first layer; forming a second electrically conductive circuit on an insulating plate having through holes formed therein and plating said through holes and opposite surfaces of the insulating plate, thereby forming a second layer; heat sticking said first layer onto said second layer; and filling said through holes with an electrically conductive material, thereby electrically connecting the first and second electrically conductive circuits.

REFERENCES:
patent: 4518764 (1985-05-01), Tanaka et al.
patent: 4894271 (1990-01-01), Hani et al.
patent: 4923678 (1990-05-01), Benedikt et al.

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