Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-06-16
1999-12-07
Mayes, Curtis
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 8912, 156256, 310324, B32B 3126, H01L 4108
Patent
active
059976713
ABSTRACT:
A ceramic diaphragm structure includes a ceramic substrate having at least one window portion, and a thin ceramic diaphragm plate laminated so as to cover the window portion, wherein the ceramic diaphragm structure is unitarily formed so that the thin ceramic diaphragm portion is protruded in the direction opposite to the window portion, and a ceramic connecting layer connects the thin ceramic diaphragm plate to the ceramic substrate. The ceramic diaphragm structure has a high resonance frequency, an enhanced strength, an excellent quality and a high reliability.
REFERENCES:
patent: 4635079 (1987-01-01), Hubbard
patent: 4766671 (1988-08-01), Utsumi et al.
patent: 5089455 (1992-02-01), Ketcham et al.
patent: 5126615 (1992-06-01), Takeuchi et al.
patent: 5210455 (1993-05-01), Takeuchi et al.
patent: 5475279 (1995-12-01), Takeuchi et al.
patent: 5517076 (1996-05-01), Takeuchi et al.
patent: 5545461 (1996-08-01), Takeuchi et al.
patent: 5600197 (1997-02-01), Takeuchi et al.
patent: 5634999 (1997-06-01), Takeuchi et al.
patent: 5767612 (1998-06-01), Takeuchi et al.
patent: 5798168 (1998-08-01), Takeuchi et al.
patent: 5809626 (1998-09-01), Takeuchi et al.
Nanataki Tsutomu
Takeuchi Katsuyuki
Takeuchi Yukihisa
Mayes Curtis
NGK Insulators Ltd.
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