Low temperature single step curing polyimide adhesive

Details Low temperature single step curing polyimide adhesive Low temperature single step curing polyimide adhesive

1986-06-04

1987-12-22

Schofer, Joseph L.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

524397, 524439, C08K 515

Patent

active

047147261

ABSTRACT:
Disclosed is a silver-filled paste, an electronic assembly comprising a semiconductive device attached to a substrate by said silver-filled paste, and a method of bonding an electronic device to a substrate using said silver-filled paste. The silver-filled paste comprises a silver powder; a resin having the formula: ##STR1## wherein R comprises a divalent linking group; and a solvent for the resin which comprises one or more electron donor groups.

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patent: 4519941 (1985-05-01), Anderson
"New-Aromatic-Ether Bismaleimide Matrix Resins", By James A. Harvey, Richard P. Chartoff & John M. Butler.
"BMIs-Composites For High Temperatures", By John C. Bittence, Advanced Materials & Processes, 1/86--pp. 23-23.
"Characterization of Bismaleimide System, XU 292, By M. Chaudhari, T. Galvin & J. King--Sampe Journal Jul./Aug. 1985--pp. 17-21.

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