Adjustment pumping plate design for the chamber of semiconductor

Details Adjustment pumping plate design for the chamber of semiconductor Adjustment pumping plate design for the chamber of semiconductor

1998-07-09

1999-12-07

Monin, Jr., Donald L.

Metal working

Barrier layer or semiconductor device making

295921, 438 5, 438935, H01S 400

Patent

active

05997589&

ABSTRACT:
A semiconductor fabrication chamber is disclosed which contains (a) a main chamber; (b) a baffle member separating the main chamber into a first chamber and a second chamber, (c)a vacuum pump to pump gas through the main chamber; and (d) a computer. The first chamber contains a gas inlet, a metering device, and a supporting member to support a wafer to be fabricated, and the second chamber contains a gas outlet and a first pressure gauge. The baffle member contains at least one adjustable opening which is controllable by the computer. Prior to a fabrication process, such as plasma etching, a pressure difference between the first pressure gauge and a temporary pressure gauge installed inside the second chamber is calculated and compared against a standard value, and the computer will adjust the opening of the baffle plate so as to minimize such pressure difference, which is related to the deposition of particulate matters on the opening. A flow meter can also be installed inside the second chamber for adjustment of the baffle plate opening during the fabricating process.

REFERENCES:
patent: 4836233 (1989-06-01), Milgate
patent: 4859625 (1989-08-01), Matsumoto
patent: 5015327 (1991-05-01), Taguchi et al.
patent: 5261935 (1993-11-01), Ishii et al.
patent: 5702562 (1997-12-01), Wakahara
patent: 5900103 (1999-05-01), Tomoyasu et al.

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