Wire bonded microfuse and method of making

Details Wire bonded microfuse and method of making Wire bonded microfuse and method of making

1987-03-24

1988-09-13

Broome, H.

Electricity: electrothermally or thermally actuated switches

Electrothermally actuated switches

Fusible element actuated

337208, 337273, 361104, H01H 8516

Patent

active

047712600

ABSTRACT:
A microfuse (10) with a ceramic chip (12), thick film pads (14), fusible wire (16), attached to pads (14) without solder or flux, ceramic coating (18) and plastic body (20). External lead (24) configuration can be axial, radial or surface mount. The method of manufacturing the fuse (10) is improved by utilizing a wire bonding technique in order to improve the quality of the manufacturing process and increase the reliability in performance of the fuse and reduce manufacturing cost.

REFERENCES:
patent: 4540969 (1985-09-01), Sugar
patent: 4547830 (1985-10-01), Yamauchi
patent: 4612529 (1986-09-01), Gurevich et al.

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