Semiconductor module having projecting cooling fin groups

Details Semiconductor module having projecting cooling fin groups Semiconductor module having projecting cooling fin groups

1991-11-05

1993-05-18

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165185, 174 163, 361386, 257712, H05K 720

Patent

active

052126250

ABSTRACT:
A semiconductor module with provisions for improved cooling and interconnection so as to allow for maximum chip packaging density. Air cooling is brought about by a zig-zag arrangement of groups of thin wire cooling fins mounted on a heat dissipating conductor unit also providing the necessary mechanical rigidity of the module.
The interconnection comprises a layer containing grains, preferably diamond, leaving high electrically insulating and high thermally conductive properties.

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IBM Technical Disclosure Bulletin vol. 21, No. 5, Oct. 1978, New York, article "Bush-tipped Piston for Thermal Conduction", R. G. Dessauer et al., p. 1857.
Electronics & Power, vol. 18, Jun. 1972 (Hitchen GB), article "Spherical Diamond Heatsinks" (p. 235).

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