Method of soldering leadless component carriers or the like

Details Method of soldering leadless component carriers or the like Method of soldering leadless component carriers or the like

1987-05-27

1988-09-13

Shaw, Clifford C.

Electric heating

Metal heating

For bonding with pressure

219 85BM, 219 85H, B23K 100

Patent

active

047711590

ABSTRACT:
A method of soldering leadless component carriers or the like to printed circuit boards uses a solder paste containing copper spheres in addition to particulate solder and flux. The solder is melted and the copper spheres are embedded in the resulting solder matrix, offsetting the carrier from the printed circuit board.

REFERENCES:
patent: 3597285 (1971-08-01), Aronberg
patent: 3703254 (1972-11-01), Maierson et al.
patent: 4235649 (1980-11-01), Inamura et al.
patent: 4489487 (1984-12-01), Bura

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