Process of attaching a die to a substrate using gold/silicon see

Details Process of attaching a die to a substrate using gold/silicon see Process of attaching a die to a substrate using gold/silicon see

1987-03-19

1988-09-13

Hearn, Brian E.

Fishing, trapping, and vermin destroying

148DIG12, 148DIG62, 29843, 228208, 228238, 437216, 437245, 437247, H01L 2336, H01L 21304, B01J 1700

Patent

active

047710187

ABSTRACT:
An improved method for eutectically bonding a silicon wafer onto a gold preform is described. A gold/silicon seed is placed on a pure gold preform. Then a die is placed onto the pure gold preform and the gold/silicon seed, wherein the seed acts as a catalyst to form an eutectic bond.

REFERENCES:
patent: 3298093 (1967-01-01), Cohen
patent: 3585711 (1971-06-01), Hicks
patent: 3593412 (1971-07-01), Foote
patent: 3883946 (1975-05-01), Dale
patent: 4026008 (1977-05-01), Drees et al.
patent: 4141135 (1979-02-01), Henry et al.
patent: 4160308 (1979-07-01), Courtney et al.
patent: 4396971 (1983-08-01), Beall et al.
patent: 4463059 (1984-07-01), Bhattacharyya et al.
patent: 4620215 (1986-10-01), Lee
H. F. Gray, "Some Basic Problems with Eutectic Preform . . . ", Naval Research Laboratory; Abst. No. 19, pp. 51-52.
Linn et al., "Analysis of Gold Films Used in Microcircuit Chip . . . ", Applied Surface Science, 26, (1986), pp. 211-218.
Aldersley, "Void Reduction in Gold-Silicon Eutectic Die Bonding", Benn. Electronics Publications, 1982, pp. 136-142.
Mencinger et al., "Use of Wetting Angle . . . Au-Si Eutectic Die Attach", IEEE, New York, VIII, pp. 173-179, 1985.
Hoge et al., "Some Considerations of the Gold-Silicon Die Bond . . . ", IEEE, IEDM, 1980, pp. 303-311.
Nowicki et al., "Studies of CrN-Au, as an Improved Die Attach . . . ", Thin Solid Films, 83, (1981), pp. 209-216.

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