Electroplating means for perforated printed circuit boards to be

Details Electroplating means for perforated printed circuit boards to be Electroplating means for perforated printed circuit boards to be

1992-09-04

1993-05-18

Tufariello, T. M.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204275, C25D 1700

Patent

active

052118266

ABSTRACT:
An electroplating apparatus having a plurality of upper electrolyte feeder elements and upper electrolyte discharge elements aligned transversely relative to a throughput path of the printed circuit boards and arranged in alternation above the throughput path, a plurality of lower electrolyte feeder elements and lower electrolyte discharge elements aligned transversely relative to the throughput path and arranged in alternation under the throughput path, wherein each lower electrolyte discharge element is positioned opposite an upper electrolyte feeder element and each upper electrolyte discharge elements is positioned opposite a lower electrolyte feeder element, and wherein vertical and horizontal flow components of the electrolyte solution result and their direction alternatingly changes as seen along the throughput path of the printed circuit boards.

REFERENCES:
patent: 4385967 (1983-05-01), Brady et al.
patent: 4459183 (1984-07-01), Brady et al.
patent: 4755271 (1988-07-01), Hosten
patent: 4832811 (1989-05-01), Hosten
patent: 4986888 (1991-01-01), Hosten

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