Forming electrically insulating layers by sputter deposition

Chemistry: electrical and wave energy – Processes and products

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204192EC, C23C 1500

Patent

active

041760166

ABSTRACT:
A method of making inclined sides on a metal pattern which is grown on a substrate by electroplating as a preliminary measure to the coating of the substrate with the metal pattern by an insulating layer. The main deposition of the insulating layer by sputtering is preceded by a sputter-etching step which transforms the rounded edges of the metal pattern into inclined sides.

REFERENCES:
patent: 3804738 (1974-04-01), Lechaton et al.
patent: 3983022 (1976-09-01), Auyang et al.
patent: 4022930 (1977-05-01), Fraser

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