Method of creating solder or brazing barriers

Details Method of creating solder or brazing barriers Method of creating solder or brazing barriers

1987-08-31

1989-05-09

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29829, 228118, 427 96, H05K 300, H05K 342

Patent

active

048276103

ABSTRACT:
A method of preparing a substrate such as a semiconductor chip or ceramic thin film having vias for soldering to a substrate requires that a first metal that is resistive to solder bonding be deposited on the backside of the semiconductor device. The deposited metal is removed from the surface of the semiconductor device, leaving the vias of the semiconductor device having the first metal deposited through them. This technique is useful in any requirement requiring a solder or brazing barrier. That is a photolithographic process in conjunction with a refractory or nonsolderable metal deposit is used to achieve an alloy or solder barrier.

REFERENCES:
patent: 4360968 (1982-11-01), D'Amico et al.
patent: 4544577 (1985-10-01), May

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