Method for manufacturing substrate with selectively trimmable re

Details Method for manufacturing substrate with selectively trimmable re Method for manufacturing substrate with selectively trimmable re

1981-10-26

1983-12-13

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29840, 29841, H05K 330

Patent

active

044198183

ABSTRACT:
Technique for terminating signal leads on a substrate for a semiconductor chip to discrete resistors to eliminate impedance discontinuities involves a substrate having signal leads connected to resistive material which is in turn connected to a ground bus. Laser trimming equipment is used to selectively disconnect signal leads from the resistor zone, or to create separate resistor paths for each signal lead to bus, while trimming the resistor to the required transmission line terminating value. The signal leads are connected to the semiconductor chip by elevated leads which pass over the resistive material and the ground bus.

REFERENCES:
patent: 3562592 (1971-02-01), Cooke
patent: 3714709 (1973-02-01), Liederbach
patent: 3768157 (1973-10-01), Buie
patent: 4298856 (1981-11-01), Schuchardt

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