Method of and apparatus for multi-image inspection of bonding wi

Details Method of and apparatus for multi-image inspection of bonding wi Method of and apparatus for multi-image inspection of bonding wi

1991-03-08

1994-03-29

Oberley, Alvin E.

Television

Special applications

Flaw detector

356237, H04N 718

Patent

active

052989895

ABSTRACT:
An optical system of inspecting bonding wires on a semiconductor by using a camera, focal length and depth adjusting unit, and an illumination device for irradiating brilliantly a desired portion of an inspection object with an illumination light. The focal length and depth adjusting means comprises a plurality of glass plates each having a different focal length and depth, and each bonding wire is inspected at a plurality of levels at a height position of the wire and at a plurality of portions thereof in its longitudinal direction to make a comparison between focal point evaluation quantities or feature quantities at each detected position so that wiring defects can be detected.

REFERENCES:
patent: 4305096 (1981-12-01), Yokoshima et al.
patent: 4686565 (1987-08-01), Ando
patent: 4816686 (1989-03-01), Hara et al.
patent: 4872052 (1989-10-01), Liudzius et al.
patent: 5023917 (1991-06-01), Base
patent: 5135303 (1992-08-01), Uto

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