Internally molded isolated package

Details Internally molded isolated package Internally molded isolated package

1988-12-27

1990-03-20

Davie, James W.

357 81, H01L 2328

Patent

active

049105817

ABSTRACT:
A semiconductor package having an internally isolated die flag form an externally exposed heatsink is provided by using a two stage molding process. The first molding stage provides a uniform layer of molding material of a predetermined thickness between a die flag area and a heatsink area. A second stage molding procedure then provides the packaging encapsulation thereby establishing the outer dimensions.

REFERENCES:
patent: 4637130 (1987-01-01), Fujii et al.
patent: 4642716 (1987-02-01), Wakabayashi et al.
patent: 4750030 (1988-06-01), Hatakeyama
patent: 4769344 (1988-09-01), Sakai et al.

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