Method for electrodepositing corrosion barrier on isolated circu

Details Method for electrodepositing corrosion barrier on isolated circu Method for electrodepositing corrosion barrier on isolated circu

1992-12-22

1994-07-05

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156151, 156233, 156245, 29830, 29846, 29848, 29849, B32B 3112

Patent

active

053264126

ABSTRACT:
A corrosion resistant barrier is provided for isolated circuity. An isolated circuit (10, 12) with raised interconnection features (16, 18) having a corrosion resistant gold coating (34) is formed on a reusable stainless steel mandrel (22) which is provided with indentations to define raised features. A seed layer (32) of copper is electroplated on the mandrel in a pattern of the isolated circuit to be formed. The copper seed layer (32) is then followed by electroplated layers of gold (34), nickel (36) and copper (38) until a total desired conductor thickness is achieved. A dielectric substrate (44, 46) is laminated on the multilayer conductive traces of the circuit. After removal of the multilayer circuit from the mandrel, a predrilled dielectric coverlay (50) is laminated to the circuit with holes in the coverlay receiving the raised circuit features (52). The finished part is then etched to remove the copper seed layer from the raised features.

REFERENCES:
patent: 4116517 (1978-09-01), Selvin et al.
patent: 4125310 (1978-11-01), Reardon, II et al.
patent: 4125441 (1978-11-01), Dugan
patent: 4453795 (1984-06-01), Moulin
patent: 4813129 (1989-03-01), Karnezos

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