Process for forming filaments from polyamic acid

Details Process for forming filaments from polyamic acid Process for forming filaments from polyamic acid

1974-12-11

1977-11-01

Woo, Jay H.

Plastic and nonmetallic article shaping or treating: processes

Forming continuous or indefinite length work

Shaping by extrusion

264236, 4234472, D01F 700

Patent

active

040565980

ABSTRACT:
A process for producing continuous filaments from polyamic acid suitable for conversion to polyimide filaments comprising providing a starting solution consisting essentially of equimolar amounts of P,P-diaminophenyl ether and bis-(3,4-dicarboxyphenyl) sulfone dianhydride, the remainder a solvent selected from the group consisting of dimethylformamide, methyl pyrrolidone and mixtures thereof, said starting solution having a viscosity ranging from 500 to 5,000 centipoises preferably 1,500 to 3,000 centipoises, and forming the starting solution into filaments by extruding it in a coagulating bath consisting essentially of a liquid selected from the group consisting of propanol, methyl alcohol, ethyl alcohol, butyl alcohol, a mixture of ethyl alcohol and propanol and a mixture of methyl alcohol and acetone.

REFERENCES:
patent: 3179614 (1965-04-01), Edwards
patent: 3179630 (1965-04-01), Endry
patent: 3179633 (1965-04-01), Endry
patent: 3528937 (1970-09-01), Reynolds et al.
patent: 3529051 (1970-09-01), Buckley et al.
patent: 3803081 (1974-04-01), Lubowitz
patent: 3812159 (1974-05-01), Lubowitz
patent: 3985934 (1976-10-01), Farrissey et al.

Affiliated with

Also associated with

Rating

Process for forming filaments from polyamic acid does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for forming filaments from polyamic acid, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming filaments from polyamic acid will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-7935