Method for encapsulating an integrated circuit package

Details Method for encapsulating an integrated circuit package Method for encapsulating an integrated circuit package

1996-07-29

1997-12-02

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29841, 29855, 26427215, 26427217, 257667, H01K 4300

Patent

active

056922965

ABSTRACT:
The present invention provides a method for fabricating an integrated circuit package, as well the resulting integrated circuit package, which retains a heatsink in close communication with a mold cavity. This precludes any encapsulant from flowing between the heatsink and the inner surface of a mold cavity. As a consequence, the bottom of the heatsink is not encapsulated and is thus exposed. This is accomplished by including posts, attached to the leadframe assembly, which have the function of exerting a downward force on a leadframe assembly and, in turn, on the heatsink. Tie bars, which are non-functional parts of a leadframe assembly, can be utilized as posts by bending the posts into an upright position.

REFERENCES:
patent: 3501833 (1970-03-01), Spiegler
patent: 5091341 (1992-02-01), Asada et al.
patent: 5210440 (1993-05-01), Long
patent: 5338899 (1994-08-01), Gainey
patent: 5357674 (1994-10-01), Lumbard

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