Plastic and nonmetallic article shaping or treating: processes – Including step of generating heat by friction
Patent
1981-09-30
1984-09-18
Parrish, John
Plastic and nonmetallic article shaping or treating: processes
Including step of generating heat by friction
264118, C04B 3332
Patent
active
044723334
ABSTRACT:
A ceramic substrate for use as a semiconductor package which includes a plate member having an engraved cavity portion on a first face portion thereof and having a rounded corner on a peripheral surface opposite the first face portion and having a first and second stepped crest formed along the edge formed at the boundary of a second face portion opposite said first face portion for increasing impact resistance to chipping and cracking of the ceramic substrate. A method of manufacturing the ceramic substrate includes adding the ceramic powder to a first mold member, pressing a force applying member into the first mold member, forming on the ceramic substrate a first and second stepped crest, sintering the ceramic substrate and grinding at least one of the first and second stepped crests so as to round the at least one of the stepped crests.
REFERENCES:
patent: 3768144 (1973-10-01), Heinss
patent: 4031178 (1977-06-01), Johnson
patent: 4124665 (1978-11-01), Petersen
patent: 4131664 (1978-12-01), Flowers
patent: 4159295 (1979-06-01), Mazzuchelli
patent: 4165350 (1979-08-01), Greenberg
patent: 4175106 (1979-11-01), Clarke
Narumi China Corporation
Parrish John
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