Method for removing electrical components from printed circuit b

Details Method for removing electrical components from printed circuit b Method for removing electrical components from printed circuit b

1993-04-15

1994-07-05

Bradley, P. Austin

Metal fusion bonding

Process of disassembling bonded surfaces, per se

228119, 228191, B23K 100, B23K 1018

Patent

active

053260163

ABSTRACT:
A method for removing an individual surface mounted electrical component from a printed circuit board retaining a plurality of other components. The individual component has a plurality of leads connected to circuitry on said board by a connection alloy comprising at least two constituent metals and having a given melting point less than that of either of said constituent metals. The method includes the steps of obtaining a removal alloy composed of a plurality of constituent metals and having a particular melting point below the given melting point; heating the removal alloy to a temperature greater than the particular melting point but below the given melting point so as to produce a molten state thereof; contacting the connection alloy on all of the leads with the molten removal alloy and causing thereby a reaction producing a molten state for the connection alloy; and separating the individual component from the printed circuit board while retaining thereon the other components.

REFERENCES:
patent: 3210182 (1965-10-01), Funari
Baron and Chirino, IBM Tech. Discl. Bull., vol. 19, No. 3 (Aug. 1976) p. 834.
Ward, IBM Tech. Discl. Bull., vol. 19, No. 7 (Dec. 1976) p. 2476.
Getten, IBM Tech. Discl. Bull., vol. 21, No. 12 (May 1979) p. 4790.
W. C. Ward, "Low-Melt Solder Alloy . . . " Electronic Packaging and Production, vol. 17, No. 5 (May 1977) pp. 98-102.

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