Wire bonder tail length monitor

Details Wire bonder tail length monitor Wire bonder tail length monitor

1993-03-29

1994-07-05

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 45, 228104, 2281805, H01L 21603

Patent

active

053260155

ABSTRACT:
Apparatus for monitoring the length of a fine wire tail made after the second bond of a fine wire interconnection includes a continuity circuit and a wire bond monitoring system (WBMS) in an automatic wire bonder. The Z axis position of the bonding tool is sensed to determined the height of the bonding tool on second bond and at the time the fine wire breaks from second bond. The monitoring circuit determines if the wire clamps are initiated and when and if the electronic flame-off control is fired. Logic circuit in the WBMS determine if wire tail after second bond is of a proper length to make a ball on the wire tail and if not, what remedial measures must be made to avoid damage to the semiconductor device being bonded.

REFERENCES:
patent: 4586642 (1986-05-01), Dreibelbis et al.
patent: 4925083 (1990-05-01), Farassat et al.
patent: 5037023 (1991-08-01), Akiyama et al.
patent: 5058797 (1991-10-01), Terakado et al.
patent: 5238173 (1993-08-01), Ura et al.

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