Process for improving the adhesive strength of electrolessly dep

Details Process for improving the adhesive strength of electrolessly dep Process for improving the adhesive strength of electrolessly dep

1988-12-02

1990-03-20

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4273855, 427304, 427305, 427306, B05D 512

Patent

active

049100459

ABSTRACT:
To improve the adhesive strength of electrolessly deposited metal deposits on surfaces of polyimide moulded bodies, the latter are treated with an activator formulation which, in addition to solvents, fillers and organometallic activators, preferably contains 5-25% of a polyimide as binder.

REFERENCES:
patent: 4368281 (1983-01-01), Brummett
patent: 4387192 (1983-06-01), Yonezawa
patent: 4493861 (1985-01-01), Sirinyan
patent: 4505980 (1985-03-01), Nishizawa
patent: 4546162 (1985-10-01), Zecher
patent: 4549006 (1985-10-01), Zecher
patent: 4628079 (1986-12-01), Zecher
R. Cannizzaro "Applications of Polyimide Materials in Electronic Circuitry" Solid State Technology, Nov. 1969, pp. 31-38.
Julius Grant "Hackh's Chemical Dictionary" McGraw-Hill Book Company, p. 527.

Affiliated with

Also associated with

Rating

Process for improving the adhesive strength of electrolessly dep does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for improving the adhesive strength of electrolessly dep, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for improving the adhesive strength of electrolessly dep will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-791710