Patent
1989-10-10
1991-06-11
Carroll, J.
357 40, 357 65, 357 72, 357 52, 357 53, H02L 2934, H02L 2940, H02L 2348, H02L 2328
Patent
active
050236997
ABSTRACT:
A resin molded type semiconductor device has a metallic ring that is formed to cover the peripheral edge of the surface of a tetragonal semiconductor substrate. In order to prevent a passivation film on the ring from being cracked by stresses due to a resin mold package concentrating in the four corners of the semiconductor substrate, slits or rows of small holes are formed in the corner portions of the ring.
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Hara Yuji
Ito Satoru
Toya Tatsuro
Carroll J.
Hitachi , Ltd.
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