Precision dicing of silicon chips from a wafer

Details Precision dicing of silicon chips from a wafer Precision dicing of silicon chips from a wafer

1994-10-28

1996-05-28

Fourson, George

Fishing, trapping, and vermin destroying

437226, H01L 2178

Patent

active

055211259

ABSTRACT:
A wafer design and dicing technique for creating semiconductor chips from wafers. A succession of oxide layers are deposited in first and second regions of a surface of a silicon substrate. The regions are separated by a street having no oxide layers therein, and the successive oxide layers form a vertical wall with a surface normal to the surface of the silicon substrate. A shock-absorbent material is deposited in the street, forming a concave meniscus therein. The shock-absorbent material retards the trajectories of silicon particles set into motion when the wafer is diced into chips.

REFERENCES:
patent: 3924323 (1975-12-01), Trevail et al.
patent: 4167174 (1979-09-01), Hampton et al.
patent: 4179794 (1979-12-01), Kosugi et al.
patent: 4729971 (1988-03-01), Coleman
patent: 4904610 (1990-02-01), Shyn
patent: 4914815 (1990-04-01), Takada et al.
patent: 4932064 (1990-06-01), Kasahara
patent: 4997793 (1991-03-01), McClurg
patent: 5024970 (1991-06-01), Mori
patent: 5083193 (1992-01-01), Heitzler et al.
patent: 5104820 (1992-04-01), Go et al.
patent: 5136354 (1992-08-01), Morita et al.
patent: 5157001 (1992-10-01), Sakuma
patent: 5160403 (1992-11-01), Fisher et al.
patent: 5214657 (1993-05-01), Farnworth et al.
patent: 5266528 (1993-11-01), Yamada
patent: 5284792 (1994-02-01), Forster et al.
patent: 5286343 (1994-02-01), Hui
patent: 5393706 (1995-02-01), Mignardi et al.

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