Die bonding apparatus

Details Die bonding apparatus Die bonding apparatus

1989-02-08

1989-11-07

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 13, 228 47, B23K 3704

Patent

active

048786101

ABSTRACT:
A die bonding apparatus includes a stocker for temporarily accommodating dice, a first conveying device for successively picking up a plurality of dice from one wafer and conveying them to the stocker, a wafer loader/unloader for replacing the wafer from which the dice have been picked up with a new one, a bonding station for bonding a die to a work which serves as a die mounting medium, a work loader for supplying works to the bonding station, and a second conveying device for successively conveying the dice accommodated in the stocker to the bonding station.

REFERENCES:
patent: 4151945 (1979-05-01), Ragard et al.
patent: 4393579 (1983-07-01), Van Hooreweder
patent: 4602417 (1986-07-01), Mesch et al.
patent: 4644642 (1987-02-01), Wardenaar et al.
patent: 4731923 (1988-03-01), Yagi et al.
patent: 4763827 (1988-08-01), Watanabe et al.
"Die bonder", Denshi Zairyo (Electronic Material), 1985, pp. 131-137.

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