Multi-layered wiring structure

Details Multi-layered wiring structure Multi-layered wiring structure

1991-06-05

1992-08-04

Prenty, Mark V.

357 71, 357 237, 357 4, H01L 2940, H01L 2348, H01L 2701, H01L 2712

Patent

active

051363585

ABSTRACT:
A multi-layered wiring structure includes a plurality of signal lines formed in a common layer and a shield line provided between any two of the lines in a separate layer, with an insulation layer being interposed, for absorbing electrical effects that will occur between the two signal lines. Also, a multi-layered wiring structure includes a plurality of thin-film transistors formed in a common layer and a shield line provided between the source electrode of one such thin-film transistor and the drain electrode of an adjacent thin-film transistor in a separate layer, with an insulation layer being interposed, for absorbing electrical effects that will occur between the source electrode of the one thin-film transistor and the drain electrode of the adjacent thin-film transistor.

REFERENCES:
patent: 4958222 (1990-09-01), Takakura et al.

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