Method of forming conductors within an insulating substrate

Details Method of forming conductors within an insulating substrate Method of forming conductors within an insulating substrate

1990-09-19

1992-08-04

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174264, H05K 100

Patent

active

051361248

ABSTRACT:
A method for forming an electrically conductive line between two layers of insulating material and method for connecting the line through both layers of the insulating material to the opposite surfaces is provided. In the method, first, second and third layers of insulating material are provided wherein the first and third layers are separated by the second layer of insulating material which is different in etch rate from the first and third layers. The edge portion of all three layers is exposed and the insulating layer of the second material is selectively etched to remove the revealed edge portion and provide a slot between the first and third layers of insulating material. Also openings are provided in both the first and third layers of insulating material which communicate with the slot and extend respectively through the layers of the first and third insulating material. Thereafter, a conductive material such as tungsten is deposited in the slot and the openings and also on the face of the stacked insulating material. Finally, the excess tungsten is removed from the faces of the insulating material of the first and third layers leaving a conductive line sandwiched between the first and third insulating layers of the material; also metal remains in the openings formed to thereby form conductive studs extending from the line to the opposite surfaces of the insulating material sandwich so formed.

REFERENCES:
patent: 3913223 (1975-10-01), Gigoux
patent: 4622058 (1986-11-01), Leary-Renick et al.
patent: 4866507 (1989-09-01), Jacobs et al.
patent: 4879156 (1989-11-01), Herron et al.

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