Method of making an electronic package with a thermally conducti

Details Method of making an electronic package with a thermally conducti Method of making an electronic package with a thermally conducti

1995-02-01

1996-05-28

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 524, 174 525, 257666, 437211, 437220, H05K 334

Patent

active

055199364

ABSTRACT:
An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

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