Solder sealed bandpass filter and method of making

Details Solder sealed bandpass filter and method of making Solder sealed bandpass filter and method of making

1989-04-03

1990-11-13

Arnold, Bruce Y.

350 17, G02B 520, G02B 524

Patent

active

049697161

ABSTRACT:
The fabrication and structure of a hermetically sealed, environmentally-sensitive, thin film coating between two planar transmitting substrates is disclosed. The edges of the substrates are metallized to allow solder to wet and form a vapor barrier. Two such substrates are assembled with an O-ring spacer or an epoxy/glue spacer and the assembly is then soldered to a protective ring using a benign low temperature indium based solder. Fluxes from the soldering step are separated from the coating by the O-ring spacer, which also acts as an aperture stop.

REFERENCES:
patent: 3709765 (1973-01-01), Miles
Brunsting et al, "Environmental Effects on All-Dielectric Bandpass Filters", Applied Optics, vol. 25, No. 18, Sep. 15, 1986, p. 3235.
Photonics Products Catalogue, 10/87, p. 124.

Affiliated with

Also associated with

Rating

Solder sealed bandpass filter and method of making does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder sealed bandpass filter and method of making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder sealed bandpass filter and method of making will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-772901