Thin film package for mixed bonding of chips

Details Thin film package for mixed bonding of chips Thin film package for mixed bonding of chips

1989-09-18

1990-10-23

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361400, 361405, 361406, H05K 100

Patent

active

049657003

ABSTRACT:
The disclosure describes a method of manufacturing a structure of a thin, flexible package assembly that permits electrical devices to be bonded to an electrical circuit utilizing mixed bonding techniques. A sacrificial metal carrier material is used to support a thin polyimide or TEFLON substrate, through which openings, called "vias", are formed at locations where bonding pad areas are needed to affix electrical devices. An electrical circuit is formed on the thin flexible substrate, including making the vias conductive, utilizing known processes, and then, the sacrificial metal carrier material is removed, as for example by etching it away, except in locations where metal bumps will be needed to bond a device by thermo compression bonding.

REFERENCES:
patent: 3683105 (1972-08-01), Shamash et al.
patent: 4242719 (1980-12-01), Conley
patent: 4413309 (1983-11-01), Takahashi et al.
patent: 4480288 (1984-10-01), Gazdik et al.
patent: 4772936 (1988-09-01), Reding et al.

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