Method for manufacturing highly heat-resistant dielectrics

Details Method for manufacturing highly heat-resistant dielectrics Method for manufacturing highly heat-resistant dielectrics

1988-05-09

1990-10-23

Bell, Janyce

Stock material or miscellaneous articles

Composite

427 96, 427240, 4273936, 4273855, 427 58, 4284744, 437231, B32B 904, B05D 512

Patent

active

049651340

ABSTRACT:
A method for manufacturing highly heat resistant dielectrics is provided wherein an oligomeric and/or polymeric hydroxypolyamide is dissolved in an organic solvent and then applied to a substrate. The solvent is removed and the hydroxypolyamide is converted into a polybenzoxazole by annealing at a temperature of between 200.degree. to 500.degree. C. The resulting dielectrics are stable up to 550.degree. C. and have a continuous temperature resistance of more than 3 hours at 470.degree. C. The dielectrics are particularly well suited for applications in microelectronics.

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Watari et al., "Packaging Technology for the NEC SX Supercomputer", 35th Electronic Components Conference, Washington U.S.A., May 1985, Report of the conference, pp. 192-198.

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