Magnetron sputtering apparatus

Details Magnetron sputtering apparatus Magnetron sputtering apparatus

1989-03-09

1990-10-23

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, C23C 1435

Patent

active

049649680

ABSTRACT:
A magnetron sputtering apparatus has a target disposed above an inner magnetic pole surrounded by an outer magnetic pole of opposite polarity and a gradient adjusting means mounted underneath the target and interposed between the inner and outer magnetic poles. The gradient adjusting means operates such that the gradient of the component of the leakage magnetic field vertical to the target is reduced over the middle portion of the target, between the inner and outer magnetic poles, and is increased at portions closer to the magnetic poles. The gradient adjusting means may be made of a soft magnetic material or a permanent magnet material, and the soft magnetic material may be used alone or in combination with the permanent magnet material. A second permanent magnet may be used in conjunction with the use of a permanent magnet as the gradient adjusting means. The magnetron sputtering apparatus prevents localized erosion of the target, thus making the area of erosion on the target more uniform, prolonging the life of the target, and providing for more even sputtered films.

REFERENCES:
patent: 4265729 (1981-05-01), Morrison, Jr.
patent: 4865708 (1989-09-01), Welty
patent: 4892633 (1990-01-01), Welty

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