Use of conductive lines on the back side of wafers and dice for

Details Use of conductive lines on the back side of wafers and dice for Use of conductive lines on the back side of wafers and dice for

1996-09-27

1998-10-06

Picardat, Kevin

Fishing, trapping, and vermin destroying

437109, H01L 2160

Patent

active

058175300

ABSTRACT:
An apparatus and a method for increasing integrated circuit density comprising semiconductor wafers, wafer portions or dice ("semiconductor elements") having conductive traces on the back side thereof. These semiconductor elements are stacked such that the traces on the back side of an upper semiconductor become part of the interconnect traces of the semiconductor stacked below. The traces lead to one or more edges of the semiconductor element such that the traces can make electrical contact with an external substrate, leadframe, or wiring arrangement.

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